No Clean Tin Lead Solder Wire Flux Cored High Quality
Basic Info
Model NO. | Sn45Pb55 |
Package | 500g/Roll |
Export Port | Gz |
Application | LED, PCB, Precise Instruments |
Flux Content | 1.8%~4.0% for Optional |
Transport Package | Customized |
Specification | 0.2 / 3 mm |
Trademark | customized |
Origin | China |
HS Code | 831130000 |
Production Capacity | 6000 Tons |
Product Description
Basic Info
Model No: Sn45Pb55
Feature: No Clean, Bright Spot, No Splash and Smokeless
Trademark: ZhongShi
Transport Package: Spool
Origin:DongGuan, China
HS Code: 831130000
Product Description
Our Sn50Pb50 tin lead solid solder wire and solder bar possesses the melting point of approximately 200 degrees Celsius and the working temperature of 250 degrees Celsius. Sn50Pb50 means that the alloy of soldering wire consists of the 50% tin content and the 50% lead content. The diameter of our product varies from 0.2mm to 3.0mm. Formulated by utilizing high technology, the activated flux is used as the rosin flux in tin wire.1. Features:
1. Satisfactory Solder Joint and Favorable Fluidity
Our solder joints are filled, bright and firm. Both RMA and RA cores are made in compliance with the IPC J-STD-006 and JIS Z 3283 Class AA/ Class A standards. All these solder fluxes can be dissolved in solvent, featuring very little smoke and very few splatters.
2. Flux Content%
For the vast majority of applications, the flux content is recommended to range from 1.8% to 4.0%.The wire diameter is optional, including 0.2 to 3.5mm.
2. Specification:
No. | Item | SPEC |
1 | Components | Sn45Pb55 |
2 | Flux Content % | 2.2 |
3 | Flux continuity | good fluidness |
4 | Halide Content (Wt%) | <0.5 |
5 | Copper Plate Corrosion | Pass |
6 | Copper Mirror Corrosion | Pass |
7 | Insulated Resistance (Ω) | 10 >1X10 |
8 | Water-soluble resistors (Ω.cm) | 10 >1X10 |
9 | Extend rate % | >90 |
10 | Residuum | Pass |
11 | Diameter (mm) | Φ0.2-3.0mm |
12 | Packing | 10reel/carton, 10kg/carton |
Components | Impurity Content % | |||||||||||
Norm | Sn | Pb | Sb | Ag | Cu | Fe | Zn | Bi | Al | As | Ni | Cd |
50±0.8 | remnant | ≤0.10% | ≤0.02% | 0.1% | ≤0.02% | ≤0.001% | ≤0.10% | ≤0.001% | ≤0.03% | ≤0.01% | <0.01% | |
Results | 50. | remnant | 0.032 | 0.0002 | 0.0057 | 0.002 | 0.0015 | 0.006 | 0.0024 | 0.0021 | 0.0032 | 0.0001 |