Syringe Jar IC Reballing Low Temperature Sn42bi58 Silver Bearing Sac305 BGA SMD SMT PCB Reflow Soldering Lead Free Tin Rosin Flux Solder Paste for Electronics

Syringe Jar IC Reballing Low Temperature Sn42bi58 Silver Bearing Sac305 BGA SMD SMT PCB Reflow Soldering Lead Free Tin Rosin Flux Solder Paste for Electronics

We produce differenty types of solder paste: Lead Free Solder Paste: Sn96.5Ag3.0Cu0.5, Sn99Ag0.3Cu0.7, Sn42Bi58 etc Lead
Basic Info
Model NO. Solder Paste
Metal Coating Tin
Mode of Production SMT
Layers Double-Layer
Base Material FR-4
Certification RoHS
Customized Customized
Condition New
Alloy Lead Free
Powder Size Type 3: 25 to 45 Microns
Powder Size 2 Type 4: 20 to 38 Microns
Flux No Clean Flux
Alloy 2 Sac305 Sn96.5AG3.0cu0.5
Alloy 3 Sac0307 Sn99AG0.3cu0.7
Alloy 4 Sn42bi58 Low Temperature
Certificate RoHS
Packing Jar
Packing 2 Syringe
Shipping Courier / Air Freight
Shelf Life 6months
Storage 0 to 10 Degree Celsius
Application SMT
Application 2 SMD
Transport Package Foam Box
Specification 100g to 1000g
Trademark XF Solder
Origin China
HS Code 3810100000
Production Capacity 30tons/Month
Product Description
We produce differenty types of solder paste:
Lead Free Solder Paste: Sn96.5Ag3.0Cu0.5, Sn99Ag0.3Cu0.7, Sn42Bi58 etc
Leaded Solder Paste: Sn63Pb37, Sn60Pb40, Sn50Pb50 etc

Syringe Jar IC Reballing Low Temperature Sn42bi58 Silver Bearing Sac305 BGA SMD SMT PCB Reflow Soldering Lead Free Tin Rosin Flux Solder Paste for Electronics

Syringe Jar IC Reballing Low Temperature Sn42bi58 Silver Bearing Sac305 BGA SMD SMT PCB Reflow Soldering Lead Free Tin Rosin Flux Solder Paste for Electronics

Syringe Jar IC Reballing Low Temperature Sn42bi58 Silver Bearing Sac305 BGA SMD SMT PCB Reflow Soldering Lead Free Tin Rosin Flux Solder Paste for Electronics

Syringe Jar IC Reballing Low Temperature Sn42bi58 Silver Bearing Sac305 BGA SMD SMT PCB Reflow Soldering Lead Free Tin Rosin Flux Solder Paste for Electronics